iFixit 拆機結果
電池容量2717mAh,L-shaped two-cell battery pack
A11晶片、SK Hynix 3GB LPDDR4x RAM 、高通LTE晶片Qualcomm's Snapdragon X16 LTE modem、 Toshiba 64GB flash storage
可維修分數6/10分
詳細內容請參閱
https://www.macrumors.com/2017/11/03/iphone-x-teardown-ifixit/
https://www.ifixit.com/Teardown/iPhone+X+Teardown/98975
aloma178 wrote:
基板好像是單面兩塊重...(恕刪)
主板似乎是substrate-like PCB (SLP)mainboard:類載板的好處在於堆疊層數變多,並可用封裝程序縮小整體面積和線寬(成本提高!?),可讓手機內部空間更加活用!另一則新聞也說到,下一代三星旗艦Galaxy S9也將採用substtrate-like PCB(SLP)主板!
https://technews.tw/2017/08/07/samsung-electronics-to-use-substrate-like-pcb-as-a-main-board-starting-from-galaxy-s9/